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Assembly Processes

    Substrate Attach
    Substrate (thick film, thin film, LTCC, FR4, duroid,  and flex circuits) attached to carriers with epoxy film/pre-forms, epoxy paste, solder preforms,  or solder paste. Epoxy board mount units are cured with custom board mount fixturing with PSI verified by load cell to insure repeatability. Large area, digitally controlled hot plate or Heller 1500W 10 zone reflow oven is used for solder board mount processing . Bondtec System used for solder attach of substrates  using Gold/Tin and Gold/Germanium pre-forms.
    Component Attach - Solder
    Solder Deposition of tin/lead, high temp and lead free solder paste via stencil printing, automatic and manual dispensing. Automatic placement of components with Mydata and Quad Pick and Place equipment and/or manual placement. Reflow with Heller 1500W 10 zone convection, Sikama 3 zone conductive oven, or hot plates. Gold/Tin, Gold/Germanium and eutectic die attach on Mechel hot gas die bonders.
    Cleaning/Solder
    Vapor degreaser for effective cleaning and removal  of all flux residue, maximizing wire bond adhesion and reliability.
    Hand Soldering
    Hand soldering of feedthrus, small gauge wires and coils, ribbons, transformers, mixer diode assemblies, connectors, and all types of surface mount and thru-hole components, wiring and ECO  modifications. All soldering personnel are certified to IPC-A-610 Class 3 workmanship standards.
    Feedthru Installation
    Installation of feedthrus, using various solder alloys, on feedthru resistance soldering station, and/or reflow with fixturing on hot plate and Heller 1500 oven. Non-hermetic feedthru installation with conductive and non-conductive epoxies.
    Open Package Leak Testing
    Open package leak testing using Varian Helium leak detector for verification of hermetic feedthru installation
    Component Attach- Epoxy
    Automatic conductive and non-conductive epoxy dispensing with Camalot epoxy dispensing systems and CW Price Screen Printers. Automatic component placement with MRSI 505 and Quad APS Hybrid die placement machines; including MMIC's, FETs, diodes, and passive devices. 360 degree die orientation with .0005" post bond tolerance. Manual epoxy and die placement using Westbond 7372 and 4200 semi-automatic die attach machines. All die attach  personnel are certified to MIL-STD 883 workmanship criteria. Flexible epoxy cure  schedules to match component and assembly heating limitations.
    Plasma Cleaning
    Plasma cleaning with high purity argon of substrates  and assembled devices to remove organic contaminants prior to bonding.
    Wire Bonding
      Ball Bonding - Automatic and manual gold ball bonding from .0008" to .002". 
      Wedge Bonding - Automatic and manual gold and aluminum wedge bonding from .0007" to .015". deep access/vertical feed capability
      Ribbon - Automatic and manual ribbon bonding from .002" to .010", deep access/vertical feed capability
    IKE Micro has extensive experience wire bonding MMICs, diodes, transistors and other components along RF lines. All wire bonding personnel are certified to MIL-STD 883 workmanship criteria.
    Wire Bond Pull Test Certifications
    IKE Micro provides destructive and non-destructive wire bond pull testing services using automatic or manual wire bonders. Bond pull machines are certified to meet MIL-STD requirements.
    Thermo-sonic Tacking/Gap Welding
    Thermo-compression and thermo-sonic  bonding of coils, ribbon, and beam lead devices on Westbond machines. Gap welding on Unitek Light Force Weld Head. Resistance welding on Unitek 80EZ Air Actuated Weld Head
    Encapsulation/Glob Top
    Encapsulation of wire bonded devices using  dam and fill or glob top dispense technologies. Dam and fill done automatically on Camalot  epoxy dispense machines. Manual dam and fill and glop top using EFD dispensers.
    Integration
    Mechanical integration of subassemblies utilizing  solders, preforms, epoxies, and various hardware.
    Inspection
      "First Piece" policy on all assembly processes.
      In process QC inspection on multi-step assemblies.
      100% final inspection on all assemblies.
      Inspection personnel are certified to IPC-A-610 and MIL-STD 883 visual acceptance criteria.
      High power scopes for die inspection services.
    Testing
    IKE Micro provides test services for most products. Please call for details.