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Assembly Processes
Substrate Attach
Substrate (thick film, thin film, LTCC, FR4, duroid,
and flex circuits) attached to carriers with epoxy film/pre-forms, epoxy paste, solder preforms,
or solder paste. Epoxy board mount units are cured with custom board mount fixturing with PSI verified
by load cell to insure repeatability. Large area, digitally controlled hot plate or Heller 1500W 10 zone reflow oven is used for solder board
mount processing . Bondtec System used for solder attach of substrates
using 80/20 preforms.
Component Attach - Solder
Solder Deposition of tin/lead, high temp and lead free solder paste via stencil printing, automatic and manual dispensing. Automatic placement of components with Mydata Pick and Place and/or manual placement. Reflow with Heller 1500W 10 zone convection, Sikama 3 zone conductive oven, or hot plates. Gold/Tin, Gold/Germanium and eutectic die attatch on Mechel hot gas die bonders.
Cleaning/Solder
Vapor degreaser for effective cleaning and removal
of all flux residue, maximizing wire bond adhesion and reliability.
Hand Soldering
Hand soldering of feedthrus, small gauge coils, ribbons, mixer diode assemblies, all types of surface mount and thru-hole components, wiring and ECO
modifications. All soldering personnel are certified to IPC-A-610 workmanship standards.
Feedthru Installation
Installation of feedthrus, using various solder alloys, on feedthru resistance soldering station, and/or reflow with fixturing on hot plate and Heller 1500 5 zone oven. Non-hermetic feedthru installation with conductive and non-conductive epoxies.
Open Package Leak Testing
Open package leak testing using Varian Helium leak detector for verification of hermetic feedthru installation
Component Attach- Epoxy
Automatic conductive and non-conductive epoxy dispensing with MRSI 170 and Camalot 1818 epoxy dispensing systems. Automatic component placement with MRSI 505; including
MMIC's, FETs, diodes, and passive devices. 360 degree die orientation with .0005" post bond tolerance. Manual epoxy and die placement using Westbond 4200 semi-automatic die attach machines. All die attach
personnel are certified to MIL-STD 883 workmanship criteria. Flexible epoxy cure
schedules to match component and assembly heating limitations.
Plasma Cleaning
Plasma cleaning with high purity argon of substrates
and assembled devices to remove organic contaminants prior to wire bonding.
Wire Bonding
Ball Bonding - Automatic and manual gold ball bonding from .0008" to .002".
Wedge Bonding - Automatic and manual gold and aluminum wedge bonding from .0007" to .015". deep access/verticle feed capability
Ribbon - Automatic and manual ribbon bonding from .002" to .010", deep access/verticle feed capability
IKE Micro has extensive experience wire bonding MMICs, diodes, transistors and other components along RF lines. All wire bonding personnel are certified to MIL-STD 883 workmanship criteria.
Wire Bond Pull Test Certifications
IKE Micro provides destructive and non-destructive wire bond pull testing services using automatic or manual wire bonders. Bond pull machines are certified to meet MIL-STD requirements.
Thermo-sonic Tacking/Welding
Thermo-compression and thermo-sonic
bonding of coils, ribbon, and beam lead devices.
Encapsulation/Glob Top
Encapsulation of wire bonded devices using
dam and fill or glob top dispense technologies. Dam and fill done automatically on Camalot 1818
epoxy dispense machines. Manual dam and fill and glop top using EFD dispensers.
Integration
Mechanical integration of subassemblies utilizing
solders, preforms, epoxies, and various hardware.
Inspection
"First Piece" policy on all assembly processes.
In process, QC inspection on multi-step assembilies.
100% final inspection on all assembilies.
Inspection personnel are certified to IPC-A-610 and MIL-STD 883 visual acceptance criteria.
High power scopes for die inspection services.
Testing
IKE Micro provides test services for most products. Please call for details.
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