April 30, 2008

IKE Micro Adds Automated Wedge/Ribbon Bonding Capability

IKE Micro has purchased a Hesse & Knipps Bondjet Automated wedge/ribbon bonder,. The H&K bonds .0007" wire to .010" ribbon, has deep access capability, a large work area, pattern recognition, and precise looping and bond length control. The H&K bonds gold, aluminum and copper wire. For more capabilities information regarding the bonder, please contact IKE Micro.

October 12, 2007

IKE Micro announced that it has shipped 5,000 microwave modules to a local RF company

IKE has been producing the units in production for over 6 months and the program is expected to continue into 2008. The modules are part of an electronic counter measure system. This is IKE's fifth program to date producing subassemblies for jamming programs to support the effort in Iraq.

May 17, 2007

IKE Micro Adds New Assembly Capability

IKE Micro has purchased an automated work cell consisting of a MRSI 170 automatic epoxy dispenser and a MRSI 505 automatic die placement machine. We took delivery of the machines last week. MRSI will be providing on-site training for two technicians in June. We intend on having the work cell fully operational in July. To learn more about the 505 assembly capabilities, please link to a copy of the brochure: http://www.reedelectronics.com/epp/contents/images/MRSI_505_AP_Brochure.pdf The addition of the work cell will allow us to increase capacity on chip on board, hybrid, MCM and RF module assemblies, maintain critical tolerances, especially along RF lines to help reduce test and tune time, improve yields and help our customers remain competitive! IKE now has the most comprehensive and diverse assembly capability of any build to print manufacturer on the East Coast.